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 BYS11-90
Vishay General Semiconductor
Surface Mount Schottky Barrier Rectifier
FEATURES * Low profile package * Ideal for automated placement * Guardring for overvoltage protection * Low power losses, high efficiency * Very low switching losses * High surge capability
DO-214AC (SMA)
* Meets MSL level 1, per J-STD-020, LF maximum peak of 260 C * Solder dip 260 C, 40 s * Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC TYPICAL APPLICATIONS For use in high frequency inverters, switching power supplies, freewheeling diodes, oring diode, dc-to-dc converters and reverse battery protection. MECHANICAL DATA Case: DO-214AC (SMA) Epoxy meets UL 94V-0 flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22-B102 E3 suffix for consumer grade, meets JESD 201 class 1A whisker test, HE3 suffix for high reliability grade (AEC Q101 qualified), meets JESD 201 class 2 whisker test Polarity: Color band denotes the cathode end
PRIMARY CHARACTERISTICS
IF(AV) VRRM IFSM VF TJ max. 1.5 A 90 V 40 A 0.75 V 150 C
MAXIMUM RATINGS (TA = 25 C unless otherwise noted)
PARAMETER Device marking code Maximum repetitive peak reverse voltage Maximum average forward rectified current Peak forward surge current single half sine-wave superimposed on rated load Voltage rate of change (rated VR) Junction and storage temperature range 8.3 ms 10 ms VRRM IF(AV) IFSM dV/dt TJ, TSTG SYMBOL BYS11-90 BYS 109 90 1.5 40 30 10 000 - 55 to + 150 V A A V/s C UNIT
Document Number: 86014 Revision: 21-Jan-08
For technical questions within your region, please contact one of the following: PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com
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BYS11-90
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 C unless otherwise noted)
PARAMETER Maximum instantaneous forward voltage (1) Maximum DC reverse current (1) Note: (1) Pulse test: 300 s pulse width, 1 % duty cycle TEST CONDITIONS 1.0 A VRRM TJ = 25 C TJ = 100 C SYMBOL VF IR BYS11-90 750 100 1 UNIT mV A mA
THERMAL CHARACTERISTICS (TA = 25 C unless otherwise noted)
PARAMETER Maximum thermal resistance - junction lead Maximum thermal resistance - junction ambient Notes: (1) Mounted on epoxy-glass hard tissue (2) Mounted on epoxy-glass hard tissue, 50 mm2 35 m Cu (3) Mounted on Al-oxide-ceramic (Al2O3), 50 mm2 35 m Cu SYMBOL RJL RJA BYS11-90 25 150 125 (2) 100 (3)
(1)
UNIT C/W C/W
ORDERING INFORMATION (Example)
PREFERRED P/N BYS11-90-E3/TR BYS11-90-E3/TR3 BYS11-90HE3/TR
(1)
UNIT WEIGHT (g) 0.064 0.064 0.064 0.064
PREFERRED PACKAGE CODE TR TR3 TR TR3
BASE QUANTITY 1800 7500 1800 7500
DELIVERY MODE 7" diameter plastic tape and reel 13" diameter plastic tape and reel 7" diameter plastic tape and reel 13" diameter plastic tape and reel
BYS11-90HE3/TR3 (1) Note:
(1) Automotive grade AEC Q101 qualified
RATINGS AND CHARACTERISTICS CURVES (TA = 25 C unless otherwise noted)
10 TJ = 150 C 2.0 VR = VRRM, Half Sine-Wave, RthJA = 25 K/W
Average Forward Current (A)
1.6
Forward Current (A)
1
1.2
0.1 TJ = 25 C 0.01
0.8
0.4
0.001 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
0 0 40 80 120 160 200
Forward Voltage (V)
Ambient Temperature (C)
Figure 1. Forward Current vs. Forward Voltage
Figure 2. Max. Average Forward Current vs. Ambient Temperature
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For technical questions within your region, please contact one of the following: PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com
Document Number: 86014 Revision: 21-Jan-08
BYS11-90
Vishay General Semiconductor
2.0
2.0
Max. Reverse Power Dissipation (W)
VR = 0 V, Half Sine-Wave
RthJA = 25 K/W 1.6
Average Forward Current (A)
1.6 RthJA = 25 K/W 1.2
1.2
100 K/W
0.8 125 K/W 0.4
100 K/W
0.8
0.4 VR = VRRM 0 0 40 80 120 100 200
150 K/W 0 0 40 80 120 160 200
Ambient Temperature (C)
Junction Temperature (C)
Figure 3. Max. Average Forward Currentvs. Ambient Temperature
Figure 5. Max Reverse Power Dissipation vs. Junction Temperature
1000 VR = VRRM 100
180 160 f = 1 MHz
Diode Capacitance (pF)
0 40 80 120 160 200
Reverse Current (mA)
140 120 100 80 60 40 20
10
1
0.1
0 0.1 1 10 100
Junction Temperature (C)
Reverse Voltage (V)
Figure 4. Reverse Current vs. Junction Temperature
Figure 6. Diode Capacitance vs. Reverse Voltage
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
DO-214AC (SMA)
Cathode Band
Mounting Pad Layout
0.066 (1.68) MIN. 0.074 (1.88) MAX.
0.065 (1.65) 0.049 (1.25)
0.110 (2.79) 0.100 (2.54)
0.177 (4.50) 0.157 (3.99) 0.012 (0.305) 0.006 (0.152)
0.060 (1.52) MIN. 0.208 (5.28) REF.
0.090 (2.29) 0.078 (1.98)
0.060 (1.52) 0.030 (0.76)
0.008 (0.203) 0 (0) 0.208 (5.28) 0.194 (4.93)
Document Number: 86014 Revision: 21-Jan-08
For technical questions within your region, please contact one of the following: PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com
www.vishay.com 3
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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